This term is defined in ECSS-Q-ST-70-08C as
condition in a soldered area in which the liquid solder has not adhered intimately, characterized by an abrupt boundary between solder and conductor, or solder and terminal/termination area

This term is defined in ECSS-Q-ST-70-10C as
condition that results when molten solder coats a surface and then recedes to leave irregularly-shaped mounds of solder that are separated by areas that are covered with a thin film of solder and with the basis metal not exposed [IEC 60194 (1999-04)]”