ECSS-Q-ST-70-38C Rev.1 Corr.1


chip devices lifting off one of their two terminal footprints causing the chip to stand up like a tombstone


  • NOTE Normally caused by: - bad design where one footprint reaches solder reflow temperature before the other - different quantities of solder paste on each footprint - different solderability of one footprint or one termination with respect to the other.
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