Glossary

Popular terms

review item discrepancy (RID) issue, identified by a reviewer, that is not compliant with a requirement, a review objective or a design goal ECSS-M-ST-10-01C

latching current limiter (LCL) switchable and latching protection placed between a power source and the relevant load, causing a trip-off after having achieved at its output an overcurrent limitation for a definite trip-off time ECSS-E-ST-20-20C

review activity undertaken to determine the suitability, adequacy and effectiveness of the subject matter to achieve established objectives ECSS-S-ST-00-01C

magnetic local time (MLT) parameter analogous to longitude, often used to describe positions in near-Earth space ECSS-E-ST-10-04C Rev.1

class 2 change change that does not fulfil class 1 change criteria ECSS-M-ST-40C Rev. 1

outgassing rate mass of molecular species evolving from a material per unit time and unit surface area ECSS-E-ST-20-06C Rev.1

infrared spectroscopy spectroscopy in the infrared region of the electromagnetic spectrum, i.e. with wavelength range from approximately 0,78 mm to 1 000 mm (wave number range 12 820 cm-1 to 10 cm-1) [adapted from ASTM-E-131] ECSS-Q-ST-70-05C Rev.1

category 1 manufacturer manufacturer with a technology domain approved or pending approval by the approving authority ECSS-Q-ST-60-05C Rev. 1

tilt for HP height of the evaporator above the condenser during ground testing ECSS-E-ST-31-02C Rev.1

RH relative humidity ECSS-Q-ST-70-26C Rev.1 Corr.1

DPAK diode package ECSS-Q-ST-70-38C Rev.1 Corr.1

r.m.s. root-mean-square ECSS-Q-ST-70-38C Rev.1 Corr.1

SIR surface insulation resistance ECSS-Q-ST-70-38C Rev.1 Corr.1

SOT small outline transistor ECSS-Q-ST-70-38C Rev.1 Corr.1

TO transistor outline ECSS-Q-ST-70-38C Rev.1 Corr.1

NA not applicable ECSS-Q-ST-60-14C Rev.1 Corr.1

RH relative humidity ECSS-Q-ST-60-14C Rev.1 Corr.1

AWG American wire gauge ECSS-Q-ST-70-26C Rev.1 Corr.1

DRD document requirement definition ECSS-Q-ST-70-26C Rev.1 Corr.1

IPA iso-propyl alcohol ECSS-Q-ST-70-26C Rev.1 Corr.1

KIP key inspection point ECSS-Q-ST-70-26C Rev.1 Corr.1

MIP mandatory inspection point ECSS-Q-ST-70-26C Rev.1 Corr.1

NCR nonconformance report ECSS-Q-ST-70-26C Rev.1 Corr.1

QA quality assurance ECSS-Q-ST-70-26C Rev.1 Corr.1

RFW request for waiver ECSS-Q-ST-70-26C Rev.1 Corr.1

CBGA ceramic ball grid array ECSS-Q-ST-70-38C Rev.1 Corr.1

CCGA ceramic column grid array ECSS-Q-ST-70-38C Rev.1 Corr.1

CGA column grid array ECSS-Q-ST-70-38C Rev.1 Corr.1

CLCC ceramic leaded chip carrier ECSS-Q-ST-70-38C Rev.1 Corr.1

CTE coefficient of thermal expansion ECSS-Q-ST-70-38C Rev.1 Corr.1

DRD document requirement definition ECSS-Q-ST-70-38C Rev.1 Corr.1

FP flat pack package ECSS-Q-ST-70-38C Rev.1 Corr.1

JEDEC Joint Electron Device Engineering Council ECSS-Q-ST-70-38C Rev.1 Corr.1

LCCC leadless ceramic chip carrier ECSS-Q-ST-70-38C Rev.1 Corr.1

MELF metal electrode face bonded ECSS-Q-ST-70-38C Rev.1 Corr.1

MIP mandatory inspection point ECSS-Q-ST-70-38C Rev.1 Corr.1

PLCC plastic leaded chip carrier ECSS-Q-ST-70-38C Rev.1 Corr.1

QFN quad flat pack no leads ECSS-Q-ST-70-38C Rev.1 Corr.1

QFP quad flat pack ECSS-Q-ST-70-38C Rev.1 Corr.1

SMD surface mounted device ECSS-Q-ST-70-38C Rev.1 Corr.1

SO small outline ECSS-Q-ST-70-38C Rev.1 Corr.1

SOD small outline device ECSS-Q-ST-70-38C Rev.1 Corr.1

SOP small outline package ECSS-Q-ST-70-38C Rev.1 Corr.1

TSOP thin small outline package ECSS-Q-ST-70-38C Rev.1 Corr.1

AQL acceptance quality limit ECSS-Q-ST-60-14C Rev.1 Corr.1

CCD charge coupled device ECSS-Q-ST-60-14C Rev.1 Corr.1

CDM charge device model ECSS-Q-ST-60-14C Rev.1 Corr.1

DSP digital signal processor ECSS-Q-ST-60-14C Rev.1 Corr.1

HBM human body model ECSS-Q-ST-60-14C Rev.1 Corr.1

JEDEC joint electronic devices engineering council ECSS-Q-ST-60-14C Rev.1 Corr.1

MM machine model ECSS-Q-ST-60-14C Rev.1 Corr.1

MSL moisture sensitivety level ECSS-Q-ST-60-14C Rev.1 Corr.1

NCR nonconformance report ECSS-Q-ST-60-14C Rev.1 Corr.1

NSA national space agency ECSS-Q-ST-60-14C Rev.1 Corr.1

SCSB space components steering board ECSS-Q-ST-60-14C Rev.1 Corr.1

VLSI very large scale integration ECSS-Q-ST-60-14C Rev.1 Corr.1

metric defined measurement method and the measurement scale ECSS-Q-ST-80C Rev.1

PID process identification document ECSS-Q-ST-70-26C Rev.1 Corr.1

RFA request for approval ECSS-Q-ST-70-26C Rev.1 Corr.1

AAD area array device ECSS-Q-ST-70-38C Rev.1 Corr.1

BGA ball grid array ECSS-Q-ST-70-38C Rev.1 Corr.1

FM flight model or flight hardware ECSS-Q-ST-70-38C Rev.1 Corr.1

PID process identification document ECSS-Q-ST-70-38C Rev.1 Corr.1

SMT surface-mount technology ECSS-Q-ST-70-38C Rev.1 Corr.1

DPA destructive physical analysis ECSS-Q-ST-60-14C Rev.1 Corr.1

MMIC microwave monolithic integrated circuit ECSS-Q-ST-60-14C Rev.1 Corr.1

class 1 change change that affects approved technical specifications, including interfaces of the same level, and associated terms of the business agreement between a customer and his supplier ECSS-M-ST-40C Rev. 1

lug metallic tube with drilled flange projection for fixing to a connection point ECSS-Q-ST-70-26C Rev.1 Corr.1

splice metallic tube for joining two or more conductors to each other ECSS-Q-ST-70-26C Rev.1 Corr.1

underfill encapsulant material deposited between a device and substrate ECSS-Q-ST-70-38C Rev.1 Corr.1

(primary) package container, envelope or wrap holding an individual item ECSS-Q-ST-60-14C Rev.1 Corr.1

(intermediate) package container holding two or more primary packages ECSS-Q-ST-60-14C Rev.1 Corr.1

storage long duration storage for which duration exceeds 3 years ECSS-Q-ST-60-14C Rev.1 Corr.1

ESCC European space components coordination ECSS-Q-ST-60-14C Rev.1 Corr.1

model philosophy definition of the optimum number and the characteristics of physical, virtual, and hybrid models required to achieve confidence in the product verification with the shortest planning and a suitable weighting of costs and risks ECSS-E-ST-10-02C Rev.1

antistatic material material that minimizes the generation of static charges ECSS-Q-ST-60-14C Rev.1 Corr.1

co-planarity maximum distance between lowest and highest termination when device rests on flat surface ECSS-Q-ST-70-38C Rev.1 Corr.1

collective assembled devices set of components that are soldered to PCB in one operation ECSS-Q-ST-70-38C Rev.1 Corr.1

ESD protective packaging packaging with ESD protective materials to prevent ESD damage to ESDS items ECSS-Q-ST-60-14C Rev.1 Corr.1

electrostatic shield barrier or enclosure that prevents or attenuates the penetration of an electric field ECSS-Q-ST-60-14C Rev.1 Corr.1

handled or handling actions during which items are hand manipulated or machine processed ECSS-Q-ST-60-14C Rev.1 Corr.1

packing operation by which supplies are placed in container or wrapped and placed in containers ECSS-Q-ST-60-14C Rev.1 Corr.1

EN European Norm ECSS-Q-ST-70-14C

(original) date code code used by the EEE part manufacturer at assembly step that indicates the production date ECSS-Q-ST-60-14C Rev.1 Corr.1

space segment subsystem subsystem within a space segment ECSS-S-ST-00-01C

space segment system system within a space segment ECSS-S-ST-00-01C

micro-yield applied force to produce a residual strain of 1 × 10-6 mm/m along the tensile or compression loading direction ECSS-E-ST-32-08C Rev. 1

F10.7 flux solar flux at a wavelength of 10.7 cm in units of 104 Jansky (one Jansky equals 10-26 Wm-2Hz-1) ECSS-E-ST-10-04C Rev.1

ferrule short metal tube used to make crimp connections to the outer conductor of shielded or coaxial cables ECSS-Q-ST-70-26C Rev.1 Corr.1

reprocessing preparatory operation done on a device prior to assembly ECSS-Q-ST-70-38C Rev.1 Corr.1

scavenging (leaching) basis metal or metallization partly or wholly dissolved in melted solder during a soldering operation ECSS-Q-ST-70-38C Rev.1 Corr.1

test vehicle Substrate assembled with Surface Mounted Devices subjected to a verification programme. ECSS-Q-ST-70-38C Rev.1 Corr.1

isolating material material not defined as conductive or dissipative are considered to be isolating ECSS-Q-ST-60-14C Rev.1 Corr.1

(final) package container holding one or more intermediate packages, used for transportation of supplies to the orderer ECSS-Q-ST-60-14C Rev.1 Corr.1

packaging operations consisting in the preparation of supplies for transit and delivery. ECSS-Q-ST-60-14C Rev.1 Corr.1

triboelectric effect generation of electrostatic charge on an object by rubbing or other type of contact. ECSS-Q-ST-60-14C Rev.1 Corr.1

CR change request ECSS-E-ST-10-24C

CP change proposal ECSS-E-ST-10-24C

AD applicable document ECSS-Q-ST-70-14C

AMS aerospace material specification ECSS-Q-ST-70-14C

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