plugged via


ECSS-Q-ST-70-60C Corr.1


via type that is cap plated and filled with resin in a specific via filling process


  • NOTE Blind vias can be resin-filled using resin from the prepreg during sequential lamination. Plugged vias use a resin that does not originate from the prepreg and the filling process does not occur during lamination.
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