combination of elements (interconnection substrate, added active or passive chips) sealed inside a package in order to perform an electronic function
NOTE 1 Interconnection substrate (e.g. thick film, thin film, co-fired, DBC) can be with or without integrated passive components (e.g. resistors, inductors, capacitors).
NOTE 2 Active parts can be monolithic or discrete, chips or packaged components.
NOTE 3 Electronic functions that are performed by hybrids include digital or analog, low frequency or radiofrequency, low power or high power functions. These functions may be mixed according to the application.
NOTE 4 The terms 'hybrid circuits' and 'hybrids' are synonymous for 'Hybrid microcircuits'.