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high density interconnect (HDI)
Standard
ECSS-Q-ST-70-12CDefinition
technology on PCB related to the pattern that allows a smaller pitch in the footprint on the surface pattern and a higher density of internal signal routing than for conventional PCBsNotes
- NOTE 1 The exact perimeter of HDI technology is described in clause 11.
- NOTE 2 This technology can be required for assembly of AAD.
- NOTE 3 An example of HDI build-up is shown in Figure 3-1.
Relations
- ECSS-Q-ST-70-60C Corr.1 — HDI
- ECSS-Q-ST-70-12C — HDI
- ECSS-Q-ST-60C Rev. 2 — PCB
- ECSS-S-ST-00-01C — PCB
- ECSS-Q-ST-70-60C Corr.1 — PCB
- ECSS-Q-ST-70-38C Rev.1 Corr.1 — PCB
- ECSS-Q-ST-70-12C — PCB
- ECSS-Q-ST-60-13C — PCB
- ECSS-Q-ST-70-50C — PCB
- ECSS-Q-ST-70-53C — PCB
- ECSS-Q-ST-70-28C — PCB
- ECSS-Q-ST-70-08C — PCB
- ECSS-Q-ST-30-02C — PCB
- ECSS-Q-ST-20-10C — PCB
- ECSS-M-ST-40C Rev. 1 — PCB
- ECSS-E-ST-20C Rev.1 — PCB
- ECSS-E-ST-20-06C Rev.1 — PCB
- ECSS-E-ST-50-12C Rev.1 — PCB
- ECSS-E-ST-50-11C — PCB
- ECSS-E-ST-50-15C — PCB
- ECSS-E-ST-10-12C — PCB
- ECSS-Q-ST-70-60C Corr.1 — routing
- ECSS-E-ST-50-11C — signal
- ECSS-E-ST-50-12C Rev.1 — signal
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