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tombstoning

Standard

ECSS-Q-ST-70-38C Rev.1 Corr.1

Definition

chip devices lifting off one of their two terminal footprints causing the chip to stand up like a tombstone

Notes

NOTE Normally caused by: - bad design where one footprint reaches solder reflow temperature before the other - different quantities of solder paste on each footprint - different solderability of one footprint or one termination with respect to the other.

Relations

ECSS-E-ST-20-08C Rev. 1 — chip
ECSS-Q-ST-70-26C Rev.1 Corr.1 — terminal

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