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smear

Standard

ECSS-Q-ST-70-60C Corr.1

Definition

base material resin that covers the interface between the exposed edge of an innerlayer pad and through-hole plating

Notes

NOTE 1 The resin transfer is usually caused by the drilling operation and removed during the desmear process. The term ‘resin smear’ or ‘smearing’ are synonymous.
NOTE 2 The aspect of smear can be mistaken for interconnect defect, or vice versa. Smear is the presence of resin, whereas interconnect defect is an adhesive separation of copper plating. [adapted from IPC-T-50M]

Relations

ECSS-E-ST-35C Rev. 1 — interface
ECSS-E-ST-31-04C — interface
ECSS-E-ST-40-07C — interface
ECSS-S-ST-00-01C — interface
ECSS-S-ST-00-01C — material
ECSS-Q-ST-70-08C — pad
ECSS-Q-ST-70-08C — resin

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