ECSS-Q-ST-70-10C – Qualification of printed circuit boards (15 November 2008)

This standard has been superseded by ECSS-Q-ST-70-60C (1 June 2018)

Note: ECSS-Q-ST-70-60C was created by merging and updating ECSS-Q-ST-70-10C and ECSS-Q-ST-70-11C


Scope

This Standard defines the requirements for evaluation, qualification and maintenance of qualification of PCB manufacturers for different types of PCBs.

This Standard is applicable to the following type of PCBs:

  • Rigid PCBs (single-sided, double-sided, multilayer, sequential-laminated multilayer, metal core)
  • Flexible PCB (single-sided and double-sided)
  • Rigid-flex PCBs (multilayer and sequential-laminated multilayer)
  • High frequency PCBs
  • Special PCBs.

PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermal and mechanical shocks during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions, and in addition the complex PCB assembly are subjected to the environment imposed by launch and space flights.

This standard may be tailored for the specific characteristics and constraints of a space project in conformance with ECSS-S-ST-00.

Attachments:

Md5 checksum .doc file = 32A8802C25343FDC3EBC83282E7DA3B7
Md5 checksum .pdf file = EC946916B4D9318115415EFD1DD77408


This Standard cancels and replaces ECSS-Q-70-10A (23 Nov 2001).