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solder
Standard
ECSS-Q-ST-70-08C - Manual soldering of high-reliability electrical connections (6 March 2009)Definition
non-ferrous fusible metallic alloy of two or more metals (usually tin and lead) used when melted to join or fuse metallic surfaces together and to provide a low resistance electrical pathNotes
Relations
- ECSS-Q-ST-70-12C — area array device (AAD)
- ECSS-Q-ST-70-12C — ball grid array (BGA)
- ECSS-Q-ST-70-08C — bridging
- ECSS-Q-ST-70-08C — cold solder joint
- ECSS-Q-ST-70-08C — cracked solder joint
- ECSS-Q-ST-70-38C Rev.1 Corr.1 — critical zone
- ECSS-Q-ST-70-08C — dewetting
- ECSS-Q-ST-70-60C Corr.1 — dewetting
- ECSS-Q-ST-70-08C — disturbed solder joint
- ECSS-Q-ST-70-60C Corr.1 — dross
- ECSS-Q-ST-70-08C — flux
- ECSS-Q-ST-70-08C — flux activity
- ECSS-Q-ST-70-08C — icicles
- ECSS-Q-ST-70-60C Corr.1 — inclusion
- ECSS-Q-ST-70-08C — lap joint
- ECSS-Q-ST-70-08C — pits
- ECSS-Q-ST-70-08C — printed circuit board (PCB)
- ECSS-Q-ST-70-28C — rework
- ECSS-Q-ST-70-60C Corr.1 — SB
- ECSS-Q-ST-70-38C Rev.1 Corr.1 — scavenging (leaching)
- ECSS-Q-ST-70-38C Rev.1 Corr.1 — selective plating
- ECSS-Q-ST-70-38C Rev.1 Corr.1 — sensitive devices
- ECSS-Q-ST-70-38C Rev.1 Corr.1 — solder balling (solder balls)
- ECSS-Q-ST-70-08C — solder coating
- ECSS-Q-ST-70-08C — solder icicle
- ECSS-Q-ST-70-38C Rev.1 Corr.1 — solder stand-off
- ECSS-Q-ST-70-08C — solderability
- ECSS-Q-ST-70-08C — soldering
- ECSS-Q-ST-70-08C — soldering time
- ECSS-Q-ST-70-08C — stress lines
- ECSS-Q-ST-70-07C — technology samples
- ECSS-Q-ST-70-08C — tinning
- ECSS-Q-ST-70-07C — wave soldering
- ECSS-Q-ST-70-08C — wicking
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