To Glossary

ball grid array (BGA)

Standard

ECSS-Q-ST-70-12C DIR1: Start of Public Review (Due: 10 January 2014)

Definition

surface mount package wherein the solder balls for terminations are formed in a grid on the bottom of the package

Notes

NOTE BGA is a specific type of AAD.

Relations

ECSS-Q-ST-60-13C — BGA
ECSS-Q-ST-70-12C — BGA
ECSS-Q-ST-70-38C Rev.1 Corr.1 — BGA
ECSS-E-ST-40-07C — package
ECSS-Q-ST-60-14C Rev.1 Corr.1 — package
ECSS-Q-ST-70-08C — solder

ECSS Glossary mobile applications

ECSS Glossary mobile apps available from iOS and Android store and ECSS Glossary Plugin for MS Word available from Microsoft Appstore
Search the online Glossary

Download ECSS eGlossary App
Android | iOS

Microsoft Office Word Plugin
Download plugin