The Standard defines acceptance and rejection criteria for high reliability manufacture of manually-soldered electrical connections intended to withstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight.
The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work.
The assembly of surface-mount devices is covered in ECSS-Q-ST-70-38.
Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-10 and ECSS-Q-ST-70-11.
Verification of manual soldering assemblies which are not described in this standard are performed by vibration and thermal cycling testing. The requirements for verification are given in this Standard.
The mounting and supporting of components, terminals and conductors prescribed herein applies to assemblies designed to operate within the temperature limits of –55°C to +85°C.
Special thermal heat sinks are applied to devices having high thermal dissipation (e.g. junction temperatures of 110°C, power transistors) in order to ensure that solder joints do not exceed 85°C.
Md5 checksum .doc file = DB016C6B1A33F8075C64B047CE1F06D6
Md5 checksum .pdf file = F62DE607A38F9FCEF824F8552ED6896F
This Standard cancels and replaces ECSS-Q-70-08A (6 August 1999).