This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits based on surface mounted device (SMD) and mixed technology.
The Standard defines acceptance and rejection criteria for high-reliability manufacture of surface-mount and mixed-technology circuit assemblies intended to withstand normal terrestrial conditions and the vibrational g‑loads and environment imposed by space flight.
The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work.
Requirements related to printed circuit boards are contained in ECSS-Q-ST-70‑10, ECSS-Q-ST-70-11 and ECSS-Q-ST-70-12 .
The mounting and supporting of devices, terminals and conductors prescribed herein applies to assemblies at PCB level designed to continuously operate over the mission within the temperature limits of -55 °C to +85 °C.
Special thermal heat sinks are applied to devices having high thermal dissipation (e.g. junction temperatures of 110 °C, power transistors) in order to ensure that solder joints do not exceed 85 °C.
Verification of SMD assembly processes is made on test vehicles (surface mount verification samples). Temperature cycling ensures the operational lifetime for spacecraft. However, mechanical testing only indicates SMD reliability as it is unlikely that the test vehicle represents every flight configuration.
This Standard cancels and replaces ECSS-Q-ST-70-38C Rev.1 (15 September 2017)
- ECSS-Q-ST-70-38C Rev.1-Corrigendum1(12September2018).pdf
- ECSS-Q-ST-70-38C Rev.1-Corrigendum1(12September2018).docx (file size about 25 MB)
Md5 checksum .doc file = DF512D596886AA763EF5E2A5AD1462B1
Md5 checksum .pdf file = 1EBF8E5ED3DEC220A50390C55D733E48
DRDs of this standard:
Process Identification Document (PID): ECSS-Q-ST-70-38C Rev.1-Cor.1(12September2018)-AnnexF.docx
SMT summary table: ECSS-Q-ST-70-38C Rev.1-Cor.1(12September2018)-AnnexH.docx